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10th Generation Intel® Xeon® /Core™ i9/i7/i5/i3 Processor (Comet Lake) Workstation-grade Fanless Embedded System. Designed for use with:

  • Factory Automation Systems
  • Intelligent Vending Applications
  • Intelligent Transportation Systems (ITS)
  • AMR/AGV (Autonomous Mobile Robots/Automated Guided Vehicles)
Model Variants of ECX-2000 Series

Model

2.5G LAN

10G LAN

10G SFP+

1G LAN

PoE

SFP

SSD Tray

USB 3.2

Iso DIO

ECX-2025R/2025FR*

3

NA

NA

6

4

NA

2

6

16

ECX-2025R/2025FR*

3

NA

NA

6

4

NA

NA

6

16

ECX-2000-PoER/2000F-PoER*

NA

NA

NA

6

4

NA

2

6

16

ECX-2000-PoE/2000F-PoE*

NA

NA

NA

6

4

NA

NA

6

16

ECX-2000-6FR/2000F-6FR*

NA

NA

NA

4

NA

2

2

6

16 GPIO

ECX-2000-6FR/2000F-6FR*

NA

NA

NA

4

NA

2

NA

6

16 GPIO

ECX-2000-4R/2000F-4R*

NA

NA

NA

4

NA

NA

2

6

16 GPIO

ECX-2000-4G/2000F-4G*

NA

NA

NA

4

NA

NA

NA

6

16 GPIO

ECX-2000-2R/2000F-2R*

NA

NA

NA

2

NA

NA

2

6

16 GPIO

ECX-2000-2R/2000F-2R*

NA

NA

NA

2

NA

NA

NA

6

16 GPIO

ECX-2055R**/2055FR*

NA

2

NA

6

4

NA

2

6

16

ECX-2055**/2055F*

NA

2

NA

6

4

NA

NA

6

16

ECX-2071R/2071FR*

NA

NA

2

6

4

NA

2

6

16

ECX-2071R/2071FR*

NA

NA

2

6

4

NA

NA

6

16

Series

CPU

GHz

TDP(W)

CPU

GHZ

TDP(W)

ECC

Intel® Xeon®

W-1290E

4.8

95

W-1290TE

4.5

35

Y

Intel® Xeon®

W-1270E

4.8

80

W-1270TE

4.4

35

Y

Intel® Xeon®

W-1250E

4.7

80

W-1250TE

3.8

35

Y

Intel® Core™

i9-10900E

4.7

65

i9-10900TE

4.5

35

N/A

Intel® Core™

i7-10700E

4.5

65

i7-10700TE

4.4

35

N/A

Intel® Core™

i5-10500E

4.2

65

i5-10500TE

3.7

35

N/A

Intel® Core™

i3-10100E

3.8

65

i3-10100TE

3.6

35

Y

System
Processor 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake-S)
Chipset Intel® W480E
BIOS AMI
SIO IT8786E
Memory 2 DDR4 2933MHz Memory, up to 64GB (ECC/Non-ECC)
OS Windows 10, Linux
I/O Interface
Serial  4 COM RS-232/422/485 (ESD 8kV)
USB
- 6 USB 3.2 (External)

- 1 USB 2.0 (Internal)  

Isolated DIO
16 Isolated DIO: 8 DI, 8 DO
LED Power, HDD, PoE, Wireless
SIM Card  2 External Nano SIM Card Socket
Expansion
Mini PCIe
1 Mini PCIe socket for PCIe/USB/SIM Card/Optional mSATA
M.2
- 1 M.2 Key B Socket (3042/3052)

- 1 M.2 Key E Socket (2230, supports CNVi)

SUMIT A,B
2 SUMIT Slot (Optional)
Graphics
Graphics Processor
- Intel® UHD Graphics 630
Interface
-  DVI-I : Up to 1920 x 1080 @60Hz
-  DVI-D : Up to 1920 x 1080 @60Hz
-  DisplayPort : Up to 4096 x 2304 @60Hz
Storage
SATA 2 SATA III (6Gbps) support S/W RAID 0, 1
mSATA 2 SATA III (Mini PCIe Type, 6Gbps)
M.2 1 M.2 Key M Socket (2280, PCIe x4)
Storage Device
- 1 Micro SD Card, Push-in/Push-out Ejector
- 2 Front-access 2.5" SSD/HDD Tray
Audio
Audio Codec Realtek ALC892, 5.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN supports iAMT 14.0
LAN 2 Intel® I210 GigE LAN
PoE 
LAN 3 to LAN 6 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
2.5G Ethernet (ECX-2025R/2025)
LAN 7 to LAN 9 Intel® I225 2.5GigE LAN
SFP (ECX-2000-6FR/6F)
LAN 5 & LAN 6 1000BASE SFP by Intel® I350
10G Ethernet/LAN (ECX-2055R/2055)
LAN 7 & LAN 8 Intel® X550-AT2 10GigE LAN
10G Ethernet/SFP+ (ECX-2071R/2071)
LAN 7 & LAN 8 Intel® X710-BM2 upports IEEE 802.3 10GBASE-T SFP+
Power
Power Input 9V to 50V, DC-in
Power Interface
-  3-pin Terminal Block : V+, V-, Frame Ground
-  4-pin Mini-DIN
Ignition Control 16-mode Software Ignition Control
Remote Switch 3-pin Terminal Block
Surge Protection Up to 80V/1ms Transient Power
Others
TPM Infineon SLB9665 supports TPM 2.0, LPC Interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Management Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension (W x L x H) 260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb) 
Mounting
-  Wallmount by mounting bracket
-  DIN Rail Mount (Optional)
-  2U Rackmount (Optional)
Environment
Operating Temperature
35W TDP CPU : -40°C to 75°C (-40°F to 167°F), Fanless
65W TDP CPU : -40°C to 55°C (-40°F to 131°F), Fanless
80W &95W TDP CPU :-40°C to 55°C (-40°F to 131°F), with Fan Sink
2.5G Series : -40°C to 70°C (-40°F to 158°F), Fanless
10G SFP+ Series :-40°C to 55°C (-40°F to 131°F), Fanless
10G LAN Series : -40°C to 70°C (-40°F to 158°F), w/ Internal Fan
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% at 75°C
Shock
-  IEC 60068-2-27
-  SSD : 50G @ wallmount, Half-sine, 11ms
Vibration -  IEC 60068-2-64
-  SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC CE, FCC, EN50155, EN50121-3-2
AttachmentSize
PDF icon ECX_2000_Data_Sheet.pdf1.11 MB

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