Click to zoom

10th Generation Intel® Xeon® /Core™ i9/i7/i5/i3 Processor (Comet Lake) Workstation-grade Fanless Embedded System. Designed for use with:

  • Factory Automation Systems
  • Intelligent Vending Applications
  • Intelligent Transportation Systems (ITS)
  • AMR/AGV (Autonomous Mobile Robots/Automated Guided Vehicles)
Model Variants of ECX-2000 Series

Model

2.5G LAN

10G LAN

10G SFP+

1G LAN

PoE

SFP

SSD Tray

USB 3.2

Iso DIO

ECX-2025R/2025FR*

3

NA

NA

6

4

NA

2

6

16

ECX-2025R/2025FR*

3

NA

NA

6

4

NA

NA

6

16

ECX-2000-PoER/2000F-PoER*

NA

NA

NA

6

4

NA

2

6

16

ECX-2000-PoE/2000F-PoE*

NA

NA

NA

6

4

NA

NA

6

16

ECX-2000-6FR/2000F-6FR*

NA

NA

NA

4

NA

2

2

6

16 GPIO

ECX-2000-6FR/2000F-6FR*

NA

NA

NA

4

NA

2

NA

6

16 GPIO

ECX-2000-4R/2000F-4R*

NA

NA

NA

4

NA

NA

2

6

16 GPIO

ECX-2000-4G/2000F-4G*

NA

NA

NA

4

NA

NA

NA

6

16 GPIO

ECX-2000-2R/2000F-2R*

NA

NA

NA

2

NA

NA

2

6

16 GPIO

ECX-2000-2R/2000F-2R*

NA

NA

NA

2

NA

NA

NA

6

16 GPIO

ECX-2055R**/2055FR*

NA

2

NA

6

4

NA

2

6

16

ECX-2055**/2055F*

NA

2

NA

6

4

NA

NA

6

16

ECX-2071R/2071FR*

NA

NA

2

6

4

NA

2

6

16

ECX-2071R/2071FR*

NA

NA

2

6

4

NA

NA

6

16

Series

CPU

GHz

TDP(W)

CPU

GHZ

TDP(W)

ECC

Intel® Xeon®

W-1290E

4.8

95

W-1290TE

4.5

35

Y

Intel® Xeon®

W-1270E

4.8

80

W-1270TE

4.4

35

Y

Intel® Xeon®

W-1250E

4.7

80

W-1250TE

3.8

35

Y

Intel® Core™

i9-10900E

4.7

65

i9-10900TE

4.5

35

N/A

Intel® Core™

i7-10700E

4.5

65

i7-10700TE

4.4

35

N/A

Intel® Core™

i5-10500E

4.2

65

i5-10500TE

3.7

35

N/A

Intel® Core™

i3-10100E

3.8

65

i3-10100TE

3.6

35

Y

System
Processor 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake-S)
Chipset Intel® W480E
BIOS AMI
SIO IT8786E
Memory 2 DDR4 2933MHz Memory, up to 64GB (ECC/Non-ECC)
OS Windows 10, Linux
I/O Interface
Serial  4 COM RS-232/422/485 (ESD 8kV)
USB
- 6 USB 3.2 (External)

- 1 USB 2.0 (Internal)  

Isolated DIO
16 Isolated DIO: 8 DI, 8 DO
LED Power, HDD, PoE, Wireless
SIM Card  2 External Nano SIM Card Socket
Expansion
Mini PCIe
1 Mini PCIe socket for PCIe/USB/SIM Card/Optional mSATA
M.2
- 1 M.2 Key B Socket (3042/3052)

- 1 M.2 Key E Socket (2230, supports CNVi)

SUMIT A,B
2 SUMIT Slot (Optional)
Graphics
Graphics Processor
- Intel® UHD Graphics 630
Interface
-  DVI-I : Up to 1920 x 1080 @60Hz
-  DVI-D : Up to 1920 x 1080 @60Hz
-  DisplayPort : Up to 4096 x 2304 @60Hz
Storage
SATA 2 SATA III (6Gbps) support S/W RAID 0, 1
mSATA 2 SATA III (Mini PCIe Type, 6Gbps)
M.2 1 M.2 Key M Socket (2280, PCIe x4)
Storage Device
- 1 Micro SD Card, Push-in/Push-out Ejector
- 2 Front-access 2.5" SSD/HDD Tray
Audio
Audio Codec Realtek ALC892, 5.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN supports iAMT 14.0
LAN 2 Intel® I210 GigE LAN
PoE 
LAN 3 to LAN 6 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
2.5G Ethernet (ECX-2025R/2025)
LAN 7 to LAN 9 Intel® I225 2.5GigE LAN
SFP (ECX-2000-6FR/6F)
LAN 5 & LAN 6 1000BASE SFP by Intel® I350
10G Ethernet/LAN (ECX-2055R/2055)
LAN 7 & LAN 8 Intel® X550-AT2 10GigE LAN
10G Ethernet/SFP+ (ECX-2071R/2071)
LAN 7 & LAN 8 Intel® X710-BM2 upports IEEE 802.3 10GBASE-T SFP+
Power
Power Input 9V to 50V, DC-in
Power Interface
-  3-pin Terminal Block : V+, V-, Frame Ground
-  4-pin Mini-DIN
Ignition Control 16-mode Software Ignition Control
Remote Switch 3-pin Terminal Block
Surge Protection Up to 80V/1ms Transient Power
Others
TPM Infineon SLB9665 supports TPM 2.0, LPC Interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Management Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension (W x L x H) 260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb) 
Mounting
-  Wallmount by mounting bracket
-  DIN Rail Mount (Optional)
-  2U Rackmount (Optional)
Environment
Operating Temperature
35W TDP CPU : -40°C to 75°C (-40°F to 167°F), Fanless
65W TDP CPU : -40°C to 55°C (-40°F to 131°F), Fanless
80W &95W TDP CPU :-40°C to 55°C (-40°F to 131°F), with Fan Sink
2.5G Series : -40°C to 70°C (-40°F to 158°F), Fanless
10G SFP+ Series :-40°C to 55°C (-40°F to 131°F), Fanless
10G LAN Series : -40°C to 70°C (-40°F to 158°F), w/ Internal Fan
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% at 75°C
Shock
-  IEC 60068-2-27
-  SSD : 50G @ wallmount, Half-sine, 11ms
Vibration -  IEC 60068-2-64
-  SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC CE, FCC, EN50155, EN50121-3-2
AttachmentSize
PDF icon ECX_2000_Data_Sheet.pdf1.11 MB

Quick and Easy Quotes

Fill out this simple form

Our Sales Engineers immediately start building a quote

We will contact you to ensure we have your exact requirements

Your detailed quote is on its way!

Just so you know ...

We hate spam as much as you do. Our passion is building rugged industrial computers, not mailing lists. Your contact information will always remain strictly confidential.

Request For Quote

Note: If not associated with a company, enter "Personal Quote" into this field.

Need Support? Contact Us! We'd love to chat with you!

GIVE US A CALL

We love speaking with our customers! Call our sales or support engineers in the USA at:
+1 (443) 595-8384

CHAT OR EMAIL

Prefer typing? No problem! Use our handy Chat Bot in the corner of this page, or email us at:
Rugged Science Sales

COME FOR A VISIT

We love in-person visits! Our design and manufacturing facilities are located at:
47 Loveton Circle, Suite Z, Sparks, MD

Rugged Science is appraised at CMMI Maturity Level 3 and is an ISO 9001:2015 & AS9100D Certified Company.